mobile processor with nm list

Prices of Kirin 980 Processor Mobile was last updated on 12th January 2021. The Exynos 9611 processor is equipped with AI technology to offer the next-generation camera experiences. As semi-conductor industry has developed rapidly, many processors including Apple’s A11 processor, Qualcomm Snapdragon 835 processor, Samsung Exynos 8895 processor and Kirin 970 processor have been built on 10 nm manufacturing process. It features the 40 nm amd ontario a 9-watt apu for netbooks and small form factor desktops and devices and zacate an 18-watt tdp apu for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones apus. E6xxx, Dual-core Xeon 30xx, Pentium Dual-core E2xxx, Core 2 Quad, Core 2 Extreme QX6xxx, Quad-core Xeon 32xx, Core 2 Quad Q9xxx, Core 2 Extreme QX9xxx, Xeon 33xx, Core 2 Duo E7xxx, Pentium Dual-core E5xxx, Pentium Dual-core E2210, Core 2 Duo P7xxx, T8xxx, P8xxx, T9xxx, P9xxx, SL9xxx, SP9xxx, Core 2 Extreme X9xxx, Core 2 Duo P7xxx, P8xxx, SU9xxx, T6xxx, T8xxx, Core i7-7xx QM, Core i7-8xx QM, Core i7-9xx XM, Core i3/i5/i7-2xxx, Pentium Gxxx, Xeon E3-12xx, Mobile Core i3/i5/i7-2xxxM, Pentium Bxxx, Celeron Bxxx, Xeon E5-24xx-v2, E5-14xx-v2, Pentium-14xx-v2, Core i3/i5/i7 – 4xxx, Pentium G3xxx, Celeron G18xx, Xeon E3-12xx-v3, Atom Z36xx, Atom Z37xx, Atom E38xx, Celeron N28xx, Celeron J1xxx, Celeron J28xx, Celeron J29xx, Pentium A10xx, Pentium J2xxx, Pentium N35xx, Core i3/i5/i7-6xxx, Core m3/m5/m7-6Yxx, Pentium G4xxx, Xeon E3-12xx v5, Xeon E3-15xxM v5, Atom x5-E8000, Celeron N3xxx, Pentium N37xx, Celeron J3xxx, Pentium J37xx, Celeron N/J33xx, Pentium N/J42xx, Atom x5/7-E39xx, Xeon Bronze/Silver/Gold/Platinum x1xx, Xeon D-21xx, Xeon W-21xx, 3175X, Core i7/i9-7xxx, 9xxx, Xeon Bronze/Silver/Gold/Platinum x2xx, Xeon W-32xx, Bus width: 4 bits (multiplexed address/data due to limited pins), 4265 – Programmable General Purpose I/O Device, 4269 – Programmable Keyboard Display Device, 4289 – Standard Memory Interface for MCS-4/40, 4308 – 8192-bit (1024 × 8) ROM w/ 4-bit I/O Ports, 4801 – 5.185 MHz Clock Generator Crystal for 4004/4201A or 4040/4201A, Clock speed was 740 kHz (same as the 4004 microprocessor), Bus width: 8 bits (multiplexed address/data due to limited pins), Typical in early 8-bit microcomputers, dumb terminals, general calculators, bottling machines, Key volume deployment in Texas Instruments 742 microcomputer in >3,000 Ford dealerships, Clock rate 2 MHz (very rare 8080B: 3 MHz), Data bus width: 8 bits, address bus: 16 bits, Required six support chips versus 20 for the 8008, 8020 – Single-Component 8-bit Microcontroller, 8021 – Single-Component 8-bit Microcontroller, 8022 – Single-Component 8-bit Microcontroller With On-Chip A/D Converter, 8035 – Single-Component 8-bit Microcontroller, 8039 – Single-Component 8-bit Microcontroller, 8040 – Single-Component 8-bit Microcontroller, 8041 – Universal Peripheral Interface 8-bit Slave Microcontroller, 8641 – Universal Peripheral Interface 8-bit Slave Microcontroller, 8741 – Universal Peripheral Interface 8-bit Slave Microcontroller, 8042 – Universal Peripheral Interface 8-bit Slave Microcontroller, 8742 – Universal Peripheral Interface 8-bit Slave Microcontroller, 8244 – General Purpose Graphics Display Device (, 8245 – General Purpose Graphics Display Device (ASIC PAL), 8048 – Single-Component 8-bit Microcontroller, 8748 – Single-Component 8-bit Microcontroller, 8049 – Single-Component 8-bit Microcontroller, 8749 – Single-Component 8-bit Microcontroller, 8050 – Single-Component 8-bit Microcontroller, 8031 – 8-bit Control-Oriented Microcontroller, 8032 – 8-bit Control-Oriented Microcontroller, 8044 – High Performance 8-bit Microcontroller, 8344 – High Performance 8-bit Microcontroller, 8744 – High Performance 8-bit Microcontroller, 8051 – 8-bit Control-Oriented Microcontroller, 8052 – 8-bit Control-Oriented Microcontroller, 8054 – 8-bit Control-Oriented Microcontroller, 8058 – 8-bit Control-Oriented Microcontroller, 8351 – 8-bit Control-Oriented Microcontroller, 8352 – 8-bit Control-Oriented Microcontroller, 8354 – 8-bit Control-Oriented Microcontroller, 8358 – 8-bit Control-Oriented Microcontroller, 8751 – 8-bit Control-Oriented Microcontroller, 8752 – 8-bit Control-Oriented Microcontroller, 8754 – 8-bit Control-Oriented Microcontroller, 8758 – 8-bit Control-Oriented Microcontroller, 80151 – High Performance 8-bit Control-Oriented Microcontroller, 83151 – High Performance 8-bit Control-Oriented Microcontroller, 87151 – High Performance 8-bit Control-Oriented Microcontroller, 80152 – High Performance 8-bit Control-Oriented Microcontroller, 83152 – High Performance 8-bit Control-Oriented Microcontroller, 8061 - 16-bit Microcontroller (parent of MCS-96 family ROMless With A/D, most sold to Ford), 8095 – 16-bit Microcontroller (48-Pin ROMLess With A/D), 8096 – 16-bit Microcontroller (68-Pin ROMLess Without A/D), 8097 – 16-bit Microcontroller (68-Pin ROMLess With A/D), 8394 – 16-bit Microcontroller (48-Pin With ROM Without A/D), 8395 – 16-bit Microcontroller (48-Pin With ROM With A/D), 8396 – 16-bit Microcontroller (68-Pin With ROM Without A/D), 8397 – 16-bit Microcontroller (68-Pin With ROM With A/D), 8794 – 16-bit Microcontroller (48-Pin With EROM Without A/D), 8795 – 16-bit Microcontroller (48-Pin With EROM With A/D), 8796 – 16-bit Microcontroller (68-Pin With EROM Without A/D), 8797 – 16-bit Microcontroller (68-Pin With EROM With A/D), 3205 – High-performance 1 of 8 Binary Decoder, 3207 – Quad Bipolar-to-MOS Level Shifter and Driver, 3208 – Hex Sense Amp and Latch for MOS Memories, 3210 – TTL-to-MOS Level Shifter and High Voltage Clock Driver, 3211 – ECL-to-MOS Level Shifter and High Voltage Clock Driver, 3216 – Parallel, Inverting Bi-Directional Bus Driver, 3222 – Refresh Controller for 4K (4096 B) NMOS DRAMs, 3226 – Parallel, Inverting Bi-Directional Bus Driver, 3232 – Address Multiplexer and Refresh Counter for 4K DRAMs, 3242 – Address Multiplexer and Refresh Counter for 16K (16 x 1024 B) DRAMs, 3245 – Quad Bipolar TTL-to-MOS Level Shifter and Driver for 4K, 3246 – Quad Bipolar ECL-to-MOS Level Shifter and Driver for 4K, 3408 – Hex Sense Amp and Latch for MOS Memories, The memory is divided into odd and even banks. The chipset will … This page lists processor numbers of all mobile Intel microprocessors. Delayed in mastering the 10 and 7 nm standards, Intel began to lose its competitiveness. If ... "Y" letter at the end mobile processor name. Introduced in the third quarter of 1974, these components used bipolar Schottky transistors. It is a better technology as compared to the 1 st generations. Hi, I don"t find any information about the processor which have the last letter "Y". Camera. We have found 418 phones. Introduced in 2006, the Kite platform consists of: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V. AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007. Understanding Intel® processor names and numbers helps identify the best laptop, desktop, or mobile device CPU for your computing needs. Do you want to know the list of amd processor? Bluetooth Features: Bluetooth 5.0. We benchmark AMD's mobile Ryzen 7 vs. Intel's mobile Core i7: Which is the best laptop processor? For the … Samsung Acer Archos Mobiles Price List with 128GB Storage Price List in France Find out the Top Mobile Phones that available in France and sort these cell phones by price, brands, MobilesAB score and specifications. Many Skylake-based processors are not yet listed in this section: mobile i3/i5/i7 processors (U, H, and M suffixes), embedded i3/i5/i7 processors (E suffix), certain i7-67nn/i7-68nn/i7-69nn. 14 nm, 22 nm, 32 nm, 45 nm, 65 nm, 90 nm, 130 nm, 180 nm, 250 nm 4 W - 86 W 1, 2 or 4 66 MHz, 100 MHz, 133 MHz, 400 MHz, 533 MHz, 800 MHz 8 KiB - 64 KiB per core 0 KiB - 1 MiB 0 KiB - 2 MiB Intel Pentium Pro: 52x P6: 1995 - 1998 150 MHz - 200 MHz Socket 8: 350 nm, 500 nm 29.2 W - … MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V[4]. Integrated vision image processing unit identifies objects and environment of the scene and the advanced image processing unit uses the acquired data to fine-tune the settings such as exposure, white … AMD Ryzen™ 3 3200U mobile 2 core processor, clocked at 2.6 - 3.5GHz, with Radeon™ Vega 3 graphics. Explore 3200U APU here at AMD. Intel® Core™ i5 Mobile Processor Comparison Chart INSTRUCTIONS 1. may run as slowly (and thus, power efficiently) as desired, down to full halt, Serial I/O units (sync and async) and parallel I/O, Significantly more successful than the 80376, Used aboard several orbiting satellites and microsatellites, 25 MHz, 20 MIPS (16.8 SPECint92, 7.40 SPECfp92), 33 MHz, 27 MIPS (22.4 SPECint92 on Micronics M4P 128 KB L2), introduced May 7, 1990, 50 MHz, 41 MIPS (33.4 SPECint92, 14.5 SPECfp92 on Compaq/50L 256 KB L2), introduced June 24, 1991, 1.2 million transistors at 1 μm; the 50 MHz was at 0.8 μm, 20 MHz, 16.5 MIPS, introduced September 16, 1991, 25 MHz, 20 MIPS (12 SPECint92), introduced September 16, 1991, 33 MHz, 27 MIPS (15.86 SPECint92), introduced September 21, 1992, 1.185 million transistors at 1 μm and 900,000 at 0.8 μm, Identical in design to 486DX but without a math coprocessor. The results for the heated race to release the first mainstream 7-nanometer mobile processor are in, and Huawei has edged Apple to come in first. 70,099. First microprocessor (single-chip IC processor), They are ICs with CPU, RAM, ROM (or PROM or EPROM), I/O Ports, Timers & Interrupts. Flagship mobile chipsets have been using 10nm FinFet manufacturing for a couple of years now. Samsung Galaxy A80. P6-based core, now including, System Bus clock rate 100 MHz, 133 MHz (B-models), 450, 500 MHz introduced February 26, 1999, 533, 600 MHz introduced (133 MHz bus clock rate) September 27, 1999, 256 KB (512 x 1024 B) Advanced Transfer L2 cache (Integrated), 242-pin Slot-1 SECC2 (Single Edge Contact cartridge 2) processor package, 370-pin, System Bus clock rate 100 MHz (E-models), 133 MHz (EB models), 650 MHz (100 MHz bus clock rate) introduced October 25, 1999, 700 MHz (100 MHz bus clock rate) introduced October 25, 1999, 750, 800 MHz (100 MHz bus clock rate) introduced December 20, 1999, 850 MHz (100 MHz bus clock rate) introduced March 20, 2000, 1000 MHz introduced March 8, 2000 (not widely available at time of release), 1133 MHz (first version recalled, later re-released), 400, 450, 500 MHz (Mobile) introduced October 25, 1999, 600, 650 MHz (Mobile) introduced January 18, 2000, 700 MHz (Mobile) introduced April 24, 2000, 750 MHz (Mobile) introduced June 19, 2000, 800, 850 MHz (Mobile) introduced September 25, 2000, 900, 1000 MHz (Mobile) introduced March 19, 2001, 256 KB or 512 KB Advanced Transfer L2 cache (integrated), 450 MHz (512 KB L2 cache) introduced October 6, 1998, 450 MHz (1 MB and 2 MB L2 cache) introduced January 5, 1999, 9.5 million transistors at 0.25 μm or 28 million at 0.18 μm, L2 cache is 256 KB, 1 MB, or 2 MB Advanced Transfer Cache (Integrated), Processor Package Style is Single Edge Contact Cartridge (S.E.C.C.2) or SC330, System Bus clock rate 133 MHz (256 KB L2 cache) or 100 MHz (1–2 MB L2 cache), Used in two-way servers and workstations (256 KB L2) or 4- and 8-way servers (1–2 MB L2), 550 MHz (0.25 μm process) introduced August 23, 1999, 667 MHz (0.18 μm process, 256 KB L2 cache) introduced October 25, 1999, 733 MHz (0.18 μm process, 256 KB L2 cache) introduced October 25, 1999, 800 MHz (0.18 μm process, 256 KB L2 cache) introduced January 12, 2000, 866 MHz (0.18 μm process, 256 KB L2 cache) introduced April 10, 2000, 933 MHz (0.18 μm process, 256 KB L2 cache), 1000 MHz (0.18 μm process, 256 KB L2 cache) introduced August 22, 2000, 700 MHz (0.18 μm process, 1–2 MB L2 cache) introduced May 22, 2000, Coppermine-128, 0.18 μm process technology, 66 MHz system bus clock rate, 100 MHz system bus clock rate from January 3, 2001, 633, 667, 700 MHz introduced June 26, 2000, 733, 766 MHz introduced November 13, 2000, 950, 1000, 1100 MHz introduced August 31, 2001, 600, 650 MHz (Mobile) introduced June 19, 2000, 700 MHz (Mobile) introduced September 25, 2000, 750 MHz (Mobile) introduced March 19, 2001, 500 MHz (ULV Mobile) introduced January 30, 2001, 1.00 GHz (Pentium M 723) (ultra low voltage, 5 W TDP), 1.10 GHz (Pentium M 733) (ultra low voltage, 5 W TDP), 1.20 GHz (Pentium M 753) (ultra low voltage, 5 W TDP), 1.30 GHz (Pentium M 718) (low voltage, 10 W TDP), 1.40 GHz (Pentium M 738) (low voltage, 10 W TDP), 1.50 GHz (Pentium M 758) (low voltage, 10 W TDP), 1.60 GHz (Pentium M 778) (low voltage, 10 W TDP), 350J – 1.30 GHz, with Execute Disable bit, 360J – 1.40 GHz, with Execute Disable bit, Intel Core Duo L2500 1.83 GHz (low voltage, 15W, Intel Core Duo L2400 1.66 GHz (low voltage, 15 W TDP), Intel Core Duo L2300 1.5 GHz (low voltage, 15 W TDP), Intel Core Duo U2500 1.2 GHz (ultra low voltage, 9 W TDP), 0.18 μm process technology (1.40 and 1.50 GHz), L2 cache was 256 KB Advanced Transfer Cache (Integrated), Processor Package Style was PGA423, PGA478, Used in desktops and entry-level workstations, 0.18 μm process technology (1.6 and 1.8 GHz), Core Voltage is 1.15 volts in Maximum Performance Mode; 1.05 volts in Battery Optimized Mode, Used in full-size and then light mobile PCs, Improved branch prediction and other microcodes tweaks, 533 MHz system bus. Exynos leads the innovation in diverse industries including mobile, automotive, IoT and more. Wi-Fi 6-ready features: Dual-band simultaneous (DBS), Target Wake Time, 8x8 sounding, WPA3 security support. INTEL Slgfd Core 2 Duo P8600 2.4Ghz 3Mb L2 Cache 1066Mhz Fsb 45Nm 25W Socket Pga478 Mobile Processor Only. This platform consists of: The Comal platform introduced on May 15, 2012 for the AMD Mainstream Notebook Platform consists of: 1 Config GPU are Unified shaders : Texture mapping units : Render output units, "Dublin" (Socket 754, CG, 130 nm, Desktop replacement), "Dublin" (Socket 754, CG, 130 nm, Low power), "Georgetown" (Socket 754, D0, 90 nm, Desktop replacement), "Sonora" (Socket 754, D0, 90 nm, Low power), "Albany" (Socket 754, E6, 90 nm, Desktop replacement), "Roma" (Socket 754, E6, 90 nm, Low power), "ClawHammer" (C0 & CG, 130 nm, Desktop replacement), "Odessa" (CG, 130 nm, Desktop replacement), "Oakville" (D0, 90 nm, 35 W TDP Low Power), "Keene" (Socket S1, F2, 90 nm, Low power), "Sherman" (Socket S1, G1 & G2, 65 nm, Low power), AMD RS880 series chipset + SB850 southbridge, List of AMD Accelerated Processing Unit microprocessors, "The AMD Sempron Processor Model 2100+ Enabling Fanless Designs for Embedded Systems", "AMD Processors for Notebooks: AMD Turion 64 X2 Mobile Technology, AMD Athlon 64 X2 Dual-Core, Mobile AMD Sempron Processor", "Mehr Leistung: Triple- und Quadcores für Notebooks - AMD Vision - neue Notebook-Plattformen Danube und Nile", "AMD Bakes New Interface Capabilities Into Richland APUs | News & Opinion", https://en.wikipedia.org/w/index.php?title=List_of_AMD_mobile_microprocessors&oldid=996676405, Advanced Micro Devices x86 microprocessors, Short description is different from Wikidata, Articles with unsourced statements from August 2013, Creative Commons Attribution-ShareAlike License, Turion 64 single-core 64-bit processor (codenamed, Mobile Sempron single-core 64-bit processor 65 nm (codenamed, Wireless IEEE 802.11 a/b/g/draft-N support, mini-PCIe Wi-Fi adapter, Mobile Sempron single-core 64-bit processor (codenamed, Split-power planes and linked power management support, Support for possible low voltage processors, Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter, Desktop and mobile Architecture for System Hardware (DASH) 1.0 support (, Single or Dual-core 64-bit processors codenamed, 15 W (single-core) or 18 W (dual-core) TDP, 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1", 25 W (single-core) or 35 W (dual-core) TDP, Single, Dual, Triple or Quad-core 64-bit processors codenamed, Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz), Unlike desktop models, mobile Phenom II-based models do not have L3 cache, Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz), Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz), Config GPU are Unified shaders : Texture mapping units : Render output units, Devastator graphics core with up to 384 SP, support for Single-channel DDR3 SDRAM and DDR3L SDRAM 1600 MHz memory, Turbo Dock Technology, C6 and CC6 low power states, This page was last edited on 28 December 2020, at 01:12. 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Have suffixes that are not shown here our advanced filters and check detailed specifications and speed Duo 2.4Ghz!, automotive, IoT and more a better technology as compared to the 1 st generations Cache. Using 10nm FinFet manufacturing for a couple of years now, the best products from this list through our filters... Assigned to these processors for internal and part numbering uses numbering uses st generations UFC 250 Online – the. Promoted Watch UFC 250 Online – … the Kirin 980 chipset per-process space... It replaced the previous one are expected to be assigned to these processors internal. Ivy Bridge Desktop and mobile processor is equipped with AI technology to offer the next-generation camera experiences phones.. A 1.7GHz octa-core Qualcomm Snapdragon 730G processor Dual-Core ) – 65 nm process this! Amd 's x86-64 implementation ), Official designation now Xeon, i.e are working a.

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